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May 01, 2005, 15:32.
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Allow us to invite you to:

European
Microelectronics and
Packaging
Symposium

PRAGUE
16th to 18th June 2004

Organised by:

IMAPS Czech and Slovak Chapter

In co-operation with:

Brno University of Technology,
Charles University in Prague
and
Czech Technical University in Prague

The European Microelectronic and Packaging Symposium Prague 2004 is one of the most outstanding European conferences, providing an international forum for the presentation and discussion of recent developments and future trends in the field of microelectronic materials, packaging and interconnection.
 
   
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