Main topics:
The EMPS will consist of invited and contributed papers in the following areas:

1. New Materials (Ceramic, Polymeric, Composites) and Film Technologies,
2. Passive Components, Passive Integrated Components and Functional MCM Circuits, Sensors and Actuators, Micro Electro Mechanical Systems,
3. Active Devices, Chip Attach, Advanced Packaging, & Chip to Package Interconnection,
4. Surface Mount Technology & Printed Wiring Board,
5. Packaging and Interconnection (High Density, Low Cost, Wafer Scale, Encapsulants, MEMS, Optoelectronics), Assembly Technologies (Conductive Adhesives, Pb-Free Solders, Surface Mount, others),
6. Electrical, Thermal and Mechanical Design, Modelling and Simulation,
7. Design, Fabrication, Processing, Diagnostics, & Quality,
8. Environmentally-friendly Electronics,
9. Microelectronic Materials, Packaging and Interconnection - Diagnostics, Quality and Reliability,
10. Wireless, Microwave, Sensors, Power Devices, Solar Cells, & Electronic Components,
11. Microelectronics Applications in Automotive, Space and Military Electronics, Data Processing, Wireless Telecommunication, Medicine and Biotechnology,
12. Advanced displays and photonic functional components.