SYMPOSIUM OPENING Josef Sikula, IMAPS CZ&SK president Heinz Ostervinter, IMAPS European
Liaison Committee president Peter Barnwell, IMAPS North America past president
Francisco Ibanez, European Union - Brussels
13:30 - 15:00
Plenary session I. Chairman: Tomas Zednicek,
AVX Czech Republic s.r.o
POSTERS AND TABLE TOP EXHIBITION PREPARATION
Investment opporunities
in the Czech electronics industry
M. Jahn, CzechInvest, Czech Republic
Trends in passive components
industry
J. Skala, AVX Czech Republic s.r.o.
Next generation thick
film for tomorrow's microelectronics industry
J. Cocker, A. Craig, DuPont (UK)
Ltd., United Kingdom
15:00 - 16:00
COFFE BREAK in
EXHIBITION
16:00 - 18:00
Plenary session II. Chairman: Tomas Zednicek,
AVX Czech Republic s.r.o.
Sub-micron MOSFETS technology
characterization by low-frequency noise
M. Toita, Asahi Kasei Microsystems, S. Sugawa, A. Teramoto and
T. Ohmi, Tohoku University, Japan
Micromachining of silicon
microstructures
S.Amon, D. Resnik, D. Vrtacnik, University
of Ljubljana, Slovenia
Microelectronics packaging
oriented research and education in the virtual world
Z. Illyefalvi-Vitez, Budapest University
of Technology and Economics, Hungary
From microelectronics
to nanoelectronics: Considerations Beyond Moore's Law
V. Musil, Brno University of Technology, Czech Republic, V.
Ac, Alexander Dubcek University of Trencin, Slovak Republic
19:00 - 22:00
WELCOME RECEPTION in POSTER and EXHIBION
HALL
THURSDAY, 17th June 2004
08:30 - 18:00
REGISTRATION
08:30
- 10:20
Session 1: Design & Processing Chairman: Gilbert de Mey,
Univeristy of Ghent , Belgium
Application
of thermo-mechanical measurements of plastic packages for reliability evaluation
of PEMS - invited A. Teverovsky, QSS Group, Inc., A. K. Sharma, NASA GSFC, USA
Influence of printed circuit board properties on solder
joint fatigue life of assembled IC packages
B. Vandevelde, M. Gonzalez, E. Beyne IMEC, Belgium, D.
Vandepitte, M. Baelmans, Catholic University of Leuven, Belgium
Reliability testing of some ceramic components and evaluation
of the results by using a novel test interpretation tool
O. Salmela, J. Sarkka, K. Andersson*, and M. Tammenmaa, Nokia
Corporation, Nokia Networks and Nokia Research Center*
Diagnostics of adhesive bonds
P.Mach, A. Duraj, D. Busek, J. Jes, T. Orth CTU Prague, Czech Republic
Bridging the gap between nanometer and meter
T. Fries, Fries Research & Technology GmbH, Germany
Low cost manufacturing
of double-sided polyimide flexible substrates using unique plating technology
and laser ablation - invited R. Berenyi, J. Deak, Budapest University
of Technoloty and Economics, Hungary
The adhesion of sputter-deposited copper on some organic
substrates
T.Uusluoto, H. Laaksonen and A. Tuominen, Tampere University
of Technology, Finland
LIDCAT: Graded build-up technology for printed circuit
boards
A. Gielen, M. Vereeken, J. de Baets, IMEC, Belgium, M.Morrell,
M. Beadel, DDI Marlow, United Kingdom, J. Vaudolon, P. Allard, Flextronics,
France, E. Blansaer, P. Colson, AMI Semiconductor, Belgium, Z. Illyefalvi-Vitez,
P. Gordon, Budapest University of Technology and Economics, Hungary
Inkjet Printing of Embedded Passive Components
E. Moderegger, A. Klamminger, G. Leising, AT&S
AG, H. Plank, S. Gamerith, G. Mauthner, T. Piok, M. Gaal, C. Gadermaier,
O. Werzer, E.J.W. List, Christian Doppler Laboratory for Advanced Functional
Materials, Austria
Session 4: Active devices Chairman: Nihal Sinnadurai,
EMPS ' 04 TPC – IMAPS United Kingdom
Shellcase packaging: a novel
approach of cross-talk suppression for system-on-chip
C. van Veen, H. J. Bergveld, T. van den Ackerveken, Nederlands
Philips Bedrijven B.V., The Netherlands, G. Zilber, D. Teomim,Shellcase
Ltd., Israel
Substrate thinning and trenching as crosstalk suppression techniques
S.M. Sinaga, A.Polyakov, M.Bartek, J.N.Burghartz, Delft University
of Technology, The Niederlands
Through wafer vias for power transistors
M. de Samber, E. van Grunsven, C. Rutjes, T. Grob, H. Kettelarij and
C. van Veen, Philips Centre for Industrial Technology, The Netherlands
Thermo-mechanical design analysis of wafer level packages
O.Wittler, D. Manessis, Technical University Berlin, J.-
P. Sommer, B. Michel Fraunhofer IZM Berlin, Germany
The bumping of wafer level chip scale packages
M.A.Whitmore, M.A. Staddon, DEK Printing Machines Ltd.,
United Kingdom, D. Manessis, Fraunhofer IZM & TU Berlin, Germany
The usage of CO2 laser in through hole plating
on PET substrates- invited F. Kolesar, P. Rajec, M. Somora, Molex Slovakia a.s., Slovakia
Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS
applications
S.Stoukatch, T. Webers, C. Winters, K. Baert, E. Beyne, IMEC, Belgium
Organic field-effect transistors
G. Wang, S. Nespurek, Academy of Sciences of the Czech Republic, I.
Zhivkov, Central Laboratory of Photoprocesses, Bulgaria
Low profile packaging solution for RF-MEMS suitable for mass production
A. Meckes, R. Aigner, F. Daeche, G. Ehrler, H.-J. Timme, M. Weber, Infineon
Technologies AG, Germany
GaAs flip chip evaluation in the 3 to 110 GHz range
C. Karnfelt, J. Rudnicki, J. P. Starski, H. Zirath Chalmers University
of Technology, K. Boustedt, Örebro University, and Ericsson AB, Sweden
12:50 - 14:20
LUNCH
14:20 - 15:50
SESSION 5: Modelling & Simulation
I. Chairman: Norocel-Dragos Codreanu,
University of Bucharest , Romania
SESSION 6: New Materials
I. Chairman: Leszek Golonka,
Wroclaw University of Technology, Poland
Electrical design
and simulation of 3-D stacked module - invited M. Mantysalo, J. Tanskanen, E. O. Ristolainen, Tampere University
of Technology, Finland
Optimizing of solder joint reliability by 3D modeling
J. Bulva, I. Szendiuch, Brno University of Technology, Czech Republic
Demonstration of increased power densities through advanced
3D power packaging
M. Tuttle, P. Byrne, N. Cordero, S.C. O’ Mathuna,
P. McCloskey, P. Cheasty, D. O’ Sullivan, NMRC, University College Cork, Ireland
Analytical thermal modeling of flip-chip mounted semiconductor
optical amplifiers
F.M. De Paola, V. D’Alessandro, F. Tamigi and N.
Rinaldi, University of Naples, Italy
Switching in molecular systems– invited S. Nespurek, G. Wang, Academy of Sciences of Czech Republic, J.
Sworakowski, Wroclaw University of Technology, Poland
Quantum effects in molecular nanodevices based on tungsten polyoxometalates
D. Velessiotis, G. Chaidogiannos, N. Glezos, P. Argitis, NCSR “Demokritos”, D.
Tsamakis, NTUA, Greece
One way to look at nano technology for circuits E. R. Egloff, The Egloff Associates, U.S.A.
Active polymers for solar cells application
J. Pfleger, M. Pavlík, Academy of Sciences of the Czech
Republic, N. Hebestreit, W. Plieth, Dresden Technical University,
Germany
15:50 - 16:30
COFFE BREAK in
EXHIBITION
16:30 - 17:50
SESSION 7: Modelling & Simulation
II. Chairman: Norocel-Dragos Codreanu, University of Bucharest ,
Romania
SESSION 8: New Materials
II. Chairman: Jean-Claude Rames,
MBDA, France
Thermal conductivity
of molten lead free solders
J. Bilek, J. Atkinson, W. Wakeham, University
of Southampton, United Kingdom
Thermo-mechanical analysis of a chip scale package (CSP)
using lead free and lead containing solder materials
M. Gonzalez, B. Vandevelde and E. Beyne, IMEC, Leuven, Belgium
An experimental and numerical study on heat spreading
enhancement in high power amplifier heat sinks L. Maguire, M. Behnia, G. Morrison, University of New
South Wales, Sydney, Australia
Creation and evaluation of dynamic compact thermal model
for system-in-package
K. Kaija, P. Heino, and E. Ristolainen, Tampere University
of Technology, Finland
Integrated thick-film
hybrid microelectronics on aluminium substrates
C. Jacq, S. Vionnet, T. Maeder, P. Ryser, École
Polytechnique Fédérale de Lausanne, Switzerland
Strength of ceramic substrates for piezoresistive thick-film
sensor applications
T. Maeder, C. Jacq, H. Birol, P. Ryser, École
Polytechnique Federale de Lausanne, Switzerland
Perovskite ruthenate-based lead-free thick film resistors S. Rane, M. Prudenziati, and B. Morten, University
of Modena, Italy
Session 10: Automotive & Space Chairman: Jens Muller,
Micro Systems Engineering , Germany
Electrically conductive
adhesives as solder alternative : A feasible challenge! - invited G. Dreezen, G. Luyckx, Emerson & Cuming, ICI Belgium N.V., Belgium
Lead-free soldering at inert atmosphere
S. Moravec, M. Valenta, Air Products spol. s r.o,
Czezh Republic, G. K. Arslanian, Air Products and Chemicals, Inc., USA
Influence of repair process on near eutectic SnAgCu solder
joint properties
R. Kisiel, Warsaw University of Technology, J.Sitek,
K. Bukat, Tele and Radio Research Institute, W.Gasior, Z.Moser, J. Pstrus,
Polish Academy of Sciences, Poland
Cleaning of electronic assemblies - a modular approach
in optimizing process configuration V. Sitko, Pbt Roznov Ltd., I. Szendiuch, Brno University
of Technology, Czech Republic
Dual channel receiver
for nerve stimulation implant- invited S.O’Reilly, O. Chevalerias and J. Alderman, NMRC, Cork, Ireland
Advanced techniques for the production of high precision
X-band power distribution / combination networks D. Köther, A. Lauer, A. Wien, P. Uhlig, G. Pautz,
G. Möllenbeck, J. Berben, IMST GmbH, Germany
Important considerations when applying plasma to advanced
packaging
J. D. Getty, U. Meyer, March Plasma Systems, The Netherlands
Die-attach to ceramic substrates for high temperature
applications
F. Oldervoll, F. Strisland, SINTEF Information
and communication technology, Norway
Electronics packaging for extreme spacecraft environments
P.J. Zulueta, Jet Propulsion Laboratory, California
Institute of Technology, USA
10:30 - 11:00
COFFE BREAK in
EXHIBITION
11:00
- 13:00
Session 11: Passive
Components I. Chairman: Darko Belavic,
HIPOT-R&D, Slovenia
Session 12:
Packaging & Interconnections
I. Chairman: Valery I. Rudakov,
Institute of Microelectronics , Russia
Some remarks about relations
between processing conditions and microstructural, electrical as well as stability
properties of LTCC resistors - invited A. Dziedzic, L. Golonka, Wroclaw University of
Technology, Poland, M. Hrovat, J. Kita, M. Kosec, Jozef Stefan Institute,
Ljubljana, Slovenia, D. Belavic, HIPOT R&D, Slovenia
Embedded passives in LTCC for RF & microwave applications G. Wang, M. Folk, A. Elshabini, F. Barlow, University of Arkansas, USA
3-D structuration of LTCC for sensor micro-fluidic applications
H. Birol, T. Maeder, C. Jacq, P. Ryser, École
Polytechnique Fédérale de Lausanne, Switzerland
Investigation of La2O3/B2O3 based
glass-ceramics for low temperature co-firing ceramics (LTCC) applications Wen-Cheng J. Wei, Chih-Lung Chen, Allen Lee, National Taiwan University,
Taiwan 106, Andreas Roosen, University of Erlangen-Nurnberg, Germany
Tantalum capacitors technology for extended operating
temperature range
Z.Sita, S. Pala, T. Zednicek, AVX Czech Republic s.r.o., Czech Republic
Jet Dispense for Electronic
and Optoelectronic Packaging - invited H. Quinones, Asymtec, USA
Novel bumpless flip chip bonding R. Lahtinen, M. Lyyra, VTI Technologies Oy, J.- P.
Rautiainen, Ahltronix Rauma O, T. Uusluoto, A. Tuominen, Tampere
University of Technology, Finland
Study of immersion tin PCB finish – some aspects of surface
and through holes wettability using lead-free solders
J. Sitek, K. Bukat, G. Koziol, J. Borecki, H. Hackiewicz, Tele
and Radio Research Institute, Poland, H. Merkle, S. Schröder, Ormecon
Chemie GmbH&Co.KG, Germany, A. Girulska, K. Gardela, Eldos Sp. z o.o.,
Poland
PBGA reliability under various manufacturing and multiple
environmental loading conditions H. Qi, M. Pecht, CALCE Electronic Products and Systems Center, University of Maryland, USA
Wedge bonding on ENIG PCB – an SMT integrated process F. Fontana , E. Perego, E. Balen, D. Casati, CELESTICA, Italy
13:00 - 14:30
LUNCH
14:30 - 16:30
SESSION 13: Passive
Components I. Chairman: Darko Belavic,
HIPOT-R&D, Slovenia
SESSION 14: Packaging & Interconnections
II. Chairman: Pal Nemeth,
BUTE, Hungary
Non-linearity and noise characterization of thick
film resistors after high voltage stress K. Hajek, University of Defence , Czech Republic, J.
Majzner, S. Hefner, V. Sedlakova, J. Sikula, Brno University of Technology,
Czech Republic
Three dimensional thick film technology
J. Krejci, Krejci Engineering, Czech Republic
Temperature characteristics of thick-film strain gauges
D. Belavic, M. Santo Zarnik, M. Pavlin, HIPOT-R&D,
d.o.o., Slovenia, M. Hrovat, S. Macek, Jozef Stefan Institute, Slovenia, J.
Kita, Wroclaw University of Technology, Poland
Packaging aspects of miniature smart sensors with an
embedded internet server
M. Pavlin, J. Gramc, D. Belavic, HIPOT-R&D,
d.o.o., Slovenia, M. Mozek, University
of Ljubljana, Slovenia
Screen-printed voltammetric genosensors for the detection
of listeria monocytogenes in food T. Oczkowski, M. Filipiak, Poznan University
of Economy,S.Achmatowicz, Institute of Electronic Materials Technology, Poland
Silicon ball grid array
package
V. Rudakov, B. Mochalov, Russian Academy of Sciences,
Russia, N. Plis, A. Muzhychenka, ICJ “Angstrem”, Russia
Development of an advanced three-dimensional MCM-D substrate
level patterning technique
T. Nellissen, M. Botermans, M. Burghoorn, J. van
Delft, E. van Grunsven, J. Scheer, M. de Samber, Philips Centre for Industrial
Technology, The Netherlands
Correlations between composition of erbium doped lithium
niobate annealed proton exchanged waveguides and their optical properties
L. Salavcova, J. Spirkova, M. Novotna, Institute
of Chemical Technology Prague, P. Capek, J. Cakl, J. Schrofel, Czech Technical
University in Prague, A. Mackova, J. Vacik, Czech Academy of Sciences,
Czech Republic
Development and thermo-mechanical characterisation of
3D folded flex module used as a technological platform for the realisation of
the I-SEED
B.Majeed, K. Delaney, J. Barton, C. O’Mathuna, University College Cork, Ireland
Investigation of laser-polymer interaction for controllable
window opening
B. Balogh, P. Gordon, R. Berényi, Z.Illyefalvi-Vitéz Budapest
University of Technology and Economics, Hungary
16:30 - 16:45
CLOSING SESSION
POSTER SESSION
The poster hall will be opened for setting the posters on Wednesday, 16 th
June, 2004 from 12:00 to 15:00. The posters should be available for visitors
from Wednesday, 16 th June, 15:00 to Friday, 18 th June, 14:30.
Authors are expected to be next to her/his poster on
Thursday, 17 th June, 2004, from 15:50 to 16:50
The poster boards are 160 cm high and 95 cm wide.
P01
Noise in 2D macroporous silicon structures L.A. Karachevceva , O.I. Danduryants, V. F. Onischenko, F.F. Sizov, National
Academy of Sciences of Ukraine, Ukraine , A. Kolek, Rzeszow University
of Technology, Poland , L. Pyziak, I.S.Virt, University of Rzeszow, Poland ,
I.S. Bilyk, Drogobych State Pedagogical University, Ukraine
P02
Infrared measurements for
reflow soldering process P. Svasta, D. Simion-Zanescu, „Politehnica” University
of Bucharest, Romania
P03
Nonlithographic nanostructured
film fabrication J. Hubalek, Brno University of Technology, Czech Republic
P04
Multicriterial characterisation
and prototyping of special planar transformers P. Svasta, C. Ionescu, N. D.Codreanu, V. Golumbeanu, „Politehnica”
University of Bucharest, Romania, D. Belavič, M. Santo Zarnik, HIPOT-R&D
and „Josef Stefan“ Institute, Slovenia
P05
New solid electrolyte capacitor
based on NbO and its applications T. Zednicek, Z. Sita, J. Pelcak, AVX Czech Republic
s.r.o.
P06
Electrically conductive adhesives
for inner connections in PCB R. Kisiel, Warsaw University of Technology, Poland, J. Borecki, Tele
and Radio Research Institute, Poland
P07
The activation of field electron
emission from printable cold cathodes Z. Znamirowski, A. Dziedzic, Z. Kowalski, J. Wilk, P. Jedrzejewski, Wroclaw
University of Technology, Poland
P08
Photoeffect in doped cadmium
sulfide powder and the preparation of polymer thick layers J. Franc, Tesla Blatná, Co., Czech Republic
P09
Amorphization by ion beam – a new way for development of
silicon nanostructures lumeniscent at room temperature D.I. Tetelbaum, A.A. Ezhevskii, A.N. Mikhaylov, M.YU. Lebedev, YU.A.
Mendeleva, R.G. Ershov, S.V. Morozov, Physico-Technical Research Institute
of Nizhnii Novgorod State University, Russia
P10
Electrically conductive adhesives
versus lead-free solders A.Duraj, P. Mach, R.Vavra, Czech Technical University in Prague, Czech Republic
P11
Triangle voltage reference
source applied on special sensor measurement L. Fujcik, R. Prokop, M. Skocdopole, R. Vrba, Brno University of Technology, Czech Republic
P12
Study of acetylcholinesterase
(ACHE) kinetics in biosensor S. Khatib, Brno University of Technology, Czech
Republic
P13
Flicker noise spectroscopy
as a diagnostic tool for defect-impurity engineering in implanted silicon M.I. Makoviychuk, E.O. Parshin, S.A. Krivelevich, Russian
Academy of Sciences, Russia, A.L. Chapkevich, Moscow Committee of Science
and Technologies, Russia
P14
Losses of planar
glass optical wavequides: correlations with technological approach K. Busek, J. Schrofel, Czech Technical University,
P. Tresnakova, L. Salavcova, J. Spirkova, Institute of Chemical Technology
Prague, Czech Republic
P15
UV laser microvias
formation in build-up glass fiber PREPREG J. Borecki, H. Hackiewicz, G. Koziol, W. Falinski, Tele
and Radio Research Institute, Poland
P16
Raman spectra of
erbium doped gallium nitride layers fabricated by magnetron sputtering V. Prajzler, J. Schröfel, Prague Czech Technical
University, I. Hüttel, J. Spirkova, V. Machovic, J. Hamacek, Prague Institute
of Chemical Technology, V. Perina, Nuclear Physics Institute, Czech Academy
of Science, Czech Republic
P17
Erbium doped waveguide
amplifiers: modelling associated to fabrication process in dielectric materials P. Capek, J. Schröfel, V. Drahos, Czech Technical
University, L. Salavcova, M. Mika, Institute of Chemical Technology Prague,
Czech Republic
P18
Wetting characteristics
study of soldering process in Nitrogen and Nitrogen/Hydrogen atmosphere J. Stary, J. Kazelle, Brno University of Technology, Czech Republic
P19
Modeling and verification
of control paths using PETRI nets E. Idzikowska, Poznan University
of Technology, Poland
P20
A numerical analysis
of the piezoresistive properties of thick-film resistors in pressure-sensor applications M. Santo Zarnik, D. Belavic, HIPOT-R&D and
Jožef Stefan Institute, Slovenia, A. Wymyslowski, K.P. Friedel, Wroclaw
University of Technology, Poland
P21
Development of
1.5 µm single mode channel annealed proton exchanged optical waveguides in lithium
niobate using non-toxic ADIPIC acid J. Cakl, P. Capek, J. Schrofel, Czech Technical
University, Czech Republic, L. Salavcova, J. Spirkova, Institute of Chemical
Technology Prague, Czech Republic
P22
Power losses phenomena
in CMOS inverter A. Golda, P. Bratek, A. Kos, AGH University of Science and Technology, Poland
P23
Copper (I) – containing
optical waveguides fabricated in novel silicate glasses P. Tresnakova, J. Spirkova, M. Mika, Institute of Chemical
Technology Prague, Czech Republic
P24
Molecular sputtering
of LIF monocrystals under polyatomic SFN+(N=1-5) ions bombardment M.Kh. Akhmadjanova, Sh.S. Radzhabov, B.G. Atabaev,
M.K. Kurbanov , Arifov Institute of Electronics Uzbek Academy
of Sciences, Uzbekistan
P25
Noise analysis
in electrical circuits A. Khateb, V. Musil, Brno University of Technology, Czech Republic
P26
Radiation influence
on durability of thin - film SiO2 L. S. Podvalniy, Institute of Microelectronics
and Informatics of Russian Academy of Sciences, Russia
P27
LTCC integrated
inductors with Ni-Cu-Zn-ferrites E. Mueller, F. Bechtold, VIA electronic GmbH, J.
Toepfer , J. Muerbe, Fachhochschule Jena, S. Barth, Hermsdorfer Institut
für Technische Keramik e.V. HITK, Germany
P28
Conductive poly[(ethylenedioxy)thiophene]
films M. Biler, H. Vrbova, AVX Czech Republic
s.r.o., S. Nespurek, Institute of Macromolecular Chemistry, Academy of
Sciences of Czech Republic
P29
Magnetron sputtered
refractory metal silicides as materials for construction of thermal converters G. Beensh-Marchwicka, E. Prociow, S. Osadnik, K.
Nitsch, Wroclaw University of Technology, Poland
P30
Thin-film silicon
and silicon-germanium alloys application for manufacturing of thermal transducer
with seebeck effect E. Prociow, G. Beensh-Marchwicka, T. Berlicki, S.
Osadnik, Wroclaw University of Technology, Poland
P31
Analysis of silver diffusion into thick film resistor layers
V. Sedlakova, J. Sikula, F Melkes, Brno University of Technology, Czech
Republic, D. Rocak, M. Hrovat and M. Santo-Zarnik, Jozef Stefan Institute,
Slovenia, D. Belavic, HIPOT R&D, Slovenia
P32
Signal to noise
ratio of piezoelectric sensors P. Sedlak, J. Majzner, S. Hefner, Brno University of Technology, Czech Republic
P33
Atomic Force Acoustical
Microscopy for industrial use
M. Meyer, J. Koglin, T. Fries, Fries
Research & Technology GmbH, Germany
P34
Optical technologies in optometry D. Barbu, Transilvania University of Brasov , Romania
P35
Optometry as an electro-bio-medical application D. Barbu, I. Barbu, Transilvania University of Brasov , Romania
P36
FR4 – ceramic “ Z ” axis solder joint reliability J. Šandera, I. Szendiuch, Brno University of Technology, Czech
Republic
EMPS 2004 Prague
Symposium Schedule in pdf format (730KB)
