| Final Symposium Schedule |
| Today is Sunday May 01, 2005, 15:32. |
| anonymous access | |
| General | |
| Committees | |
| Papers | |
| Programme | |
| Symp. Schedule | |
| + | Oral Presentation |
| + | Poster Presentation |
| Table Top | |
| Accommodation | |
| Participants Area | |
EMPS 2004 Prague
Symposium Schedule in pdf format (730KB)
| WEDNESDAY, 16th June 2004 |
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| 11:00 - 18:00 |
REGISTRATION |
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| 13:00 - 13:30 |
SYMPOSIUM OPENING Josef Sikula, IMAPS CZ&SK president Heinz Ostervinter, IMAPS European Liaison Committee president Peter Barnwell, IMAPS North America past president Francisco Ibanez, European Union - Brussels |
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| 13:30 - 15:00 |
Plenary session I. |
POSTERS AND TABLE TOP EXHIBITION PREPARATION |
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| Investment opporunities
in the Czech electronics industry |
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| Trends in passive components
industry |
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| Next generation thick
film for tomorrow's microelectronics industry |
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| 15:00 - 16:00 |
COFFE BREAK in EXHIBITION |
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| 16:00 - 18:00 |
Plenary session II. |
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| Sub-micron MOSFETS technology
characterization by low-frequency noise |
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| Micromachining of silicon
microstructures |
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| Microelectronics packaging
oriented research and education in the virtual world |
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| From microelectronics
to nanoelectronics: Considerations Beyond Moore's Law |
| 19:00 - 22:00 |
WELCOME RECEPTION in POSTER and EXHIBION HALL |
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| THURSDAY, 17th June 2004 |
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| 08:30 - 18:00 |
REGISTRATION |
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| 08:30 - 10:20 |
Session 1: Design & Processing |
Session 2: SMT Technology & PCB |
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| Application
of thermo-mechanical measurements of plastic packages for reliability evaluation
of PEMS - invited Influence of printed circuit board properties on solder
joint fatigue life of assembled IC packages Reliability testing of some ceramic components and evaluation
of the results by using a novel test interpretation tool Diagnostics of adhesive bonds Bridging the gap between nanometer and meter |
Low cost manufacturing
of double-sided polyimide flexible substrates using unique plating technology
and laser ablation - invited The adhesion of sputter-deposited copper on some organic
substrates LIDCAT: Graded build-up technology for printed circuit
boards Inkjet Printing of Embedded Passive Components |
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| 10:20 - 10:50 |
COFFE BREAK in EXHIBITION |
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| 10:50 - 12:50 | Invited Session: "Blue Whale" Chairman: Soeren Noerlyng, MICRONSULT, Denmar |
Session 4: Active devices Chairman: Nihal Sinnadurai, EMPS ' 04 TPC – IMAPS United Kingdom |
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Shellcase packaging: a novel
approach of cross-talk suppression for system-on-chip Substrate thinning and trenching as crosstalk suppression techniques Through wafer vias for power transistors Thermo-mechanical design analysis of wafer level packages The bumping of wafer level chip scale packages |
The usage of CO2 laser in through hole plating
on PET substrates - invited Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS
applications Organic field-effect transistors Low profile packaging solution for RF-MEMS suitable for mass production GaAs flip chip evaluation in the 3 to 110 GHz range |
| 12:50 - 14:20 | LUNCH | |||
| 14:20 - 15:50 |
SESSION 5: Modelling & Simulation
I. |
SESSION 6: New Materials
I. |
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| Electrical design
and simulation of 3-D stacked module - invited Optimizing of solder joint reliability by 3D modeling Demonstration of increased power densities through advanced
3D power packaging Analytical thermal modeling of flip-chip mounted semiconductor
optical amplifiers |
Switching in molecular systems – invited Quantum effects in molecular nanodevices based on tungsten polyoxometalates One way to look at nano technology for circuits Active polymers for solar cells application |
| 15:50 - 16:30 |
COFFE BREAK in EXHIBITION |
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| 16:30 - 17:50 |
SESSION 7: Modelling & Simulation
II. |
SESSION 8: New Materials
II. |
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| Thermal conductivity
of molten lead free solders Thermo-mechanical analysis of a chip scale package (CSP)
using lead free and lead containing solder materials An experimental and numerical study on heat spreading
enhancement in high power amplifier heat sinks Creation and evaluation of dynamic compact thermal model
for system-in-package |
Integrated thick-film
hybrid microelectronics on aluminium substrates Strength of ceramic substrates for piezoresistive thick-film
sensor applications Perovskite ruthenate-based lead-free thick film resistors |
| 19:30 - 24:00 |
CONFERENCE GALA DINNER IN PRAGUE CENTER |
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| FRIDAY, 18th June 2004 |
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| 08:30 – 13:00 | REGISTRATION | |||
| 08:30 - 10:30 | Session 9: Lead-free & Environmental |
Session 10: Automotive & Space |
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| Electrically conductive
adhesives as solder alternative : A feasible challenge! - invited Lead-free soldering at inert atmosphere Influence of repair process on near eutectic SnAgCu solder
joint properties Cleaning of electronic assemblies - a modular approach
in optimizing process configuration |
Dual channel receiver
for nerve stimulation implant - invited Advanced techniques for the production of high precision
X-band power distribution / combination networks Important considerations when applying plasma to advanced
packaging Die-attach to ceramic substrates for high temperature
applications Electronics packaging for extreme spacecraft environments |
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| 10:30 - 11:00 |
COFFE BREAK in EXHIBITION |
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| 11:00 - 13:00 |
Session 11: Passive
Components I. |
Session 12:
Packaging & Interconnections
I. |
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| Some remarks about relations
between processing conditions and microstructural, electrical as well as stability
properties of LTCC resistors - invited Embedded passives in LTCC for RF & microwave applications 3-D structuration of LTCC for sensor micro-fluidic applications Investigation of La2O3/B2O3 based
glass-ceramics for low temperature co-firing ceramics (LTCC) applications Tantalum capacitors technology for extended operating
temperature range |
Jet Dispense for Electronic
and Optoelectronic Packaging - invited Novel bumpless flip chip bonding Study of immersion tin PCB finish – some aspects of surface
and through holes wettability using lead-free solders PBGA reliability under various manufacturing and multiple
environmental loading conditions Wedge bonding on ENIG PCB – an SMT integrated process |
| 13:00 - 14:30 |
LUNCH |
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| 14:30 - 16:30 |
SESSION 13: Passive
Components I. |
SESSION 14: Packaging & Interconnections
II. |
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| Non-linearity and noise characterization of thick
film resistors after high voltage stress Three dimensional thick film technology Temperature characteristics of thick-film strain gauges Packaging aspects of miniature smart sensors with an
embedded internet server Screen-printed voltammetric genosensors for the detection
of listeria monocytogenes in food |
Silicon ball grid array
package Development of an advanced three-dimensional MCM-D substrate
level patterning technique Correlations between composition of erbium doped lithium
niobate annealed proton exchanged waveguides and their optical properties Development and thermo-mechanical characterisation of
3D folded flex module used as a technological platform for the realisation of
the I-SEED Investigation of laser-polymer interaction for controllable
window opening |
| 16:30 - 16:45 |
CLOSING SESSION | |||
| POSTER SESSION | |
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The poster hall will be opened for setting the posters on Wednesday, 16 th June, 2004 from 12:00 to 15:00. The posters should be available for visitors from Wednesday, 16 th June, 15:00 to Friday, 18 th June, 14:30. Authors are expected to be next to her/his poster on Thursday, 17 th June, 2004, from 15:50 to 16:50 The poster boards are 160 cm high and 95 cm wide. |
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| P01 |
Noise in 2D macroporous silicon structures L.A. Karachevceva , O.I. Danduryants, V. F. Onischenko, F.F. Sizov, National Academy of Sciences of Ukraine, Ukraine , A. Kolek, Rzeszow University of Technology, Poland , L. Pyziak, I.S.Virt, University of Rzeszow, Poland , I.S. Bilyk, Drogobych State Pedagogical University, Ukraine |
| P02 |
Infrared measurements for
reflow soldering process P. Svasta, D. Simion-Zanescu, „Politehnica” University of Bucharest, Romania |
| P03 |
Nonlithographic nanostructured
film fabrication |
| P04 |
Multicriterial characterisation
and prototyping of special planar transformers |
| P05 |
New solid electrolyte capacitor
based on NbO and its applications |
| P06 |
Electrically conductive adhesives
for inner connections in PCB |
| P07 |
The activation of field electron
emission from printable cold cathodes |
| P08 |
Photoeffect in doped cadmium
sulfide powder and the preparation of polymer thick layers |
| P09 |
Amorphization by ion beam – a new way for development of
silicon nanostructures lumeniscent at room temperature |
| P10 |
Electrically conductive adhesives
versus lead-free solders |
| P11 |
Triangle voltage reference
source applied on special sensor measurement |
| P12 |
Study of acetylcholinesterase
(ACHE) kinetics in biosensor |
| P13 |
Flicker noise spectroscopy
as a diagnostic tool for defect-impurity engineering in implanted silicon |
| P14 |
Losses of planar
glass optical wavequides: correlations with technological approach |
| P15 |
UV laser microvias
formation in build-up glass fiber PREPREG |
| P16 |
Raman spectra of
erbium doped gallium nitride layers fabricated by magnetron sputtering |
| P17 |
Erbium doped waveguide
amplifiers: modelling associated to fabrication process in dielectric materials |
| P18 |
Wetting characteristics
study of soldering process in Nitrogen and Nitrogen/Hydrogen atmosphere |
| P19 |
Modeling and verification
of control paths using PETRI nets |
| P20 |
A numerical analysis
of the piezoresistive properties of thick-film resistors in pressure-sensor applications |
| P21 |
Development of
1.5 µm single mode channel annealed proton exchanged optical waveguides in lithium
niobate using non-toxic ADIPIC acid |
| P22 |
Power losses phenomena
in CMOS inverter |
| P23 |
Copper (I) – containing
optical waveguides fabricated in novel silicate glasses |
| P24 |
Molecular sputtering
of LIF monocrystals under polyatomic SFN+(N=1-5) ions bombardment |
| P25 |
Noise analysis
in electrical circuits |
| P26 |
Radiation influence
on durability of thin - film SiO2 |
| P27 |
LTCC integrated
inductors with Ni-Cu-Zn-ferrites |
| P28 |
Conductive poly[(ethylenedioxy)thiophene]
films |
| P29 |
Magnetron sputtered
refractory metal silicides as materials for construction of thermal converters |
| P30 |
Thin-film silicon
and silicon-germanium alloys application for manufacturing of thermal transducer
with seebeck effect |
| P31 |
Analysis of silver diffusion into thick film resistor layers |
| P32 |
Signal to noise
ratio of piezoelectric sensors |
| P33 |
Atomic Force Acoustical
Microscopy for industrial use |
| P34 | Optical technologies in optometry |
| P35 | Optometry as an electro-bio-medical application |
| P36 | FR4 – ceramic “ Z ” axis solder joint reliability J. Šandera, I. Szendiuch, Brno University of Technology, Czech Republic |